- Termination :
- Features :
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
74 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,002
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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2,595
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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2,010
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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1,398
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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1,656
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
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2,947
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
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1,069
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
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|
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2,707
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
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3,863
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
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3,664
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Nickel | |||
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3,319
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
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1,211
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
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632
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
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1,748
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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656
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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|
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2,820
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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3,945
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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3,179
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
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2,688
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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|
|
3,835
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
|
2,975
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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|
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3,960
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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3,228
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
853
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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3,667
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
784
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
799
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
1,172
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
2,335
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
1,221
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper |
