24 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$35.73
RFQ
2,947
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$38.88
RFQ
3,319
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$20.12
RFQ
1,211
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$20.12
RFQ
632
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$17.99
RFQ
1,748
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
656
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,820
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,945
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,179
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,688
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,835
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,975
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
951
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
1,299
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
3,576
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
1,950
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
3,798
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$21.53
RFQ
2,244
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$13.60
RFQ
3,451
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$10.83
RFQ
1,727
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$12.72
RFQ
3,810
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$12.72
RFQ
3,449
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
44-547-11
Per Unit
$138.64
RFQ
2,674
Ships today + free overnight shipping
Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) Gold 44 (2 x 22) Beryllium Copper 0.050" (1.27mm) 20.0µin (0.51µm) Beryllium Copper
44-547-11E
Per Unit
$138.64
RFQ
3,410
Ships today + free overnight shipping
Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) Gold 44 (2 x 22) Beryllium Copper 0.050" (1.27mm) 20.0µin (0.51µm) Beryllium Copper
Page 1 / 1