87 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$108.11
RFQ
1,002
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$108.11
RFQ
2,595
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$108.11
RFQ
2,010
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$108.11
RFQ
1,398
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$46.33
RFQ
1,656
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$35.73
RFQ
2,947
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$42.19
RFQ
1,069
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$42.19
RFQ
2,707
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$42.19
RFQ
3,863
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$33.19
RFQ
3,664
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$38.88
RFQ
3,319
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$20.12
RFQ
1,211
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$20.12
RFQ
632
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$17.99
RFQ
1,748
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
656
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,820
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,945
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,179
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,688
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
3,835
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$16.19
RFQ
2,975
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
3,960
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
3,228
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
853
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
3,667
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
784
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
799
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
1,172
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
2,335
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.08
RFQ
1,221
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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