- Part Status :
- Termination :
- Housing Material :
-
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (63)
- Polybutylene Terephthalate (PBT) (2)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (7)
- Polyester (8)
- Polyester, Glass Filled (5)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (1)
- Thermoplastic, Polyester (1)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
94 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2,912
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | ||
|
|
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3,956
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | ||
|
|
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3,601
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|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||
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|
|
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726
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||
|
|
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2,618
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|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 8 (2 x 4) | - | - | - | ||
|
|
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2,626
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
GET PRICE |
3,672
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | ||
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|
|
1,607
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
|
2,234
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
3,195
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,822
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,755
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,014
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,008
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
1,483
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,034
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
2,366
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
3,069
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
1,421
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
2,839
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
2,110
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,119
Ships today + free overnight shipping
|
CNC Tech | CONN IC DIP SOCKET 8POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
3,553
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
1,035
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
1,827
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
849
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 47.2µin (1.20µm) | Copper Alloy | |||
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|
|
2,732
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
2,159
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
1,555
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,755
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
