Contact Finish - Mating :
1936 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,182
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash Tin-Lead 18 (2 x 9) Copper Alloy 80.0µin (2.03µm) Copper Alloy
2-382719-1
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3,215
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 30 (2 x 15) Beryllium Copper - Beryllium Copper
2-382714-1
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2,279
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-382712-1
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3,477
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Beryllium Copper
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3,835
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,452
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
828-AG12D
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2,243
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 28 (2 x 14) Copper Alloy - Copper Alloy
824-AG31D-ES
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2,188
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 24 (2 x 12) Copper Alloy - Copper Alloy
816-AG12D-ES
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RFQ
728
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 16 (2 x 8) Copper Alloy - Copper Alloy
808-AG12SM
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RFQ
2,912
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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RFQ
3,956
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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3,280
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CNC Tech CONN SOCKET PLCC 84POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 84 (4 x 21) Phosphor Bronze - Phosphor Bronze
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2,423
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CNC Tech CONN SOCKET PLCC 68POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 68 (4 x 17) Phosphor Bronze - Phosphor Bronze
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RFQ
3,862
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CNC Tech CONN SOCKET PLCC 52POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 52 (4 x 13) Phosphor Bronze - Phosphor Bronze
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RFQ
3,083
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CNC Tech CONN SOCKET PLCC 44POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 44 (4 x 11) Phosphor Bronze - Phosphor Bronze
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RFQ
894
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CNC Tech CONN SOCKET PLCC 32POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 32 (4 x 8) Phosphor Bronze - Phosphor Bronze
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RFQ
1,759
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CNC Tech CONN SOCKET PLCC 28POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 28 (4 x 7) Phosphor Bronze - Phosphor Bronze
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RFQ
2,980
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CNC Tech CONN SOCKET PLCC 20POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - Tin 20 (4 x 5) Phosphor Bronze - Phosphor Bronze
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RFQ
1,137
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TE Connectivity Potter & Brumfield Relays CONN IC DIP SOCKET 32POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) - 32 (2 x 16) Copper Alloy - -
268-5401-52-1102JH
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RFQ
3,406
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-50-1102JH
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RFQ
2,908
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-11-1102JH
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RFQ
1,245
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
2,161
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3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 40 (2 x 20) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
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RFQ
806
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3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 20 (2 x 10) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
A06-LCG-T
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RFQ
1,324
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Assmann WSW Components CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 6 (2 x 3) - - -
2-640358-4
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RFQ
3,162
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 16 (2 x 8) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
2-640357-4
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RFQ
1,599
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 14 (2 x 7) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
C8140-04
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RFQ
2,107
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Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8128-04
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RFQ
1,099
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Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8124-04
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RFQ
3,376
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Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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