- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
7 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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3,434
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | ||
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2,107
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Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | ||
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1,518
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Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | |||
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1,171
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Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | |||
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2,216
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | |||
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2,937
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Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | |||
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1,115
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze |