- Part Status :
- Operating Temperature :
- Termination :
- Features :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (3)
- Polyamide (PA46), Nylon 4/6, Glass Filled (7)
- Polybutylene Terephthalate (PBT) (2)
- Polybutylene Terephthalate (PBT), Glass Filled (5)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (5)
- Polyester, Glass Filled (5)
- Polyphenylene Sulfide (PPS), Glass Filled (28)
- Thermoplastic (1)
- Thermoplastic, Glass Filled (5)
- Thermoplastic, Polyester (2)
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
67 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,203
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|
Assmann WSW Components | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
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3,434
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|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||
|
|
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2,107
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|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||
|
|
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3,410
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | ||
|
|
1,612
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|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
GET PRICE |
1,091
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 40POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | ||
|
|
|
GET PRICE |
3,332
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|
3M | CONN IC DIP SOCKET 40POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | ||
|
|
GET PRICE |
1,821
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
3,394
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
3,342
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
3,905
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
2,948
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
GET PRICE |
3,968
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
GET PRICE |
2,716
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 40 (2 x 20) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||
|
|
GET PRICE |
2,464
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 40 (2 x 20) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||
|
|
|
1,518
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
1,339
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
1,084
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
2,801
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
3,052
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
2,183
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
2,765
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
3,426
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
1,102
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
949
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
3,960
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
1,243
Ships today + free overnight shipping
|
Samtec Inc. | CONN IC DIP SOCKET 40POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
1,811
Ships today + free overnight shipping
|
Samtec Inc. | CONN IC DIP SOCKET 40POS TIN | ICA | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
|
|
1,171
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
3,375
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper |
