6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$2.63
RFQ
1,634
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.43
RFQ
3,194
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.92
RFQ
3,502
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.21
RFQ
1,462
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.24
RFQ
934
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.22
RFQ
1,260
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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