44 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
299-93-626-10-002000
Per Unit
$16.48
RFQ
1,567
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 26POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$12.43
RFQ
1,016
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$15.35
RFQ
986
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$10.11
RFQ
3,499
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (2 x 13) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$12.53
RFQ
3,875
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.53
RFQ
1,260
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.45
RFQ
1,794
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.45
RFQ
864
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
2,733
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
2,805
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
940
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
2,786
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
1,022
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$12.43
RFQ
1,692
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$8.10
RFQ
2,538
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.10
RFQ
2,313
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$13.21
RFQ
3,171
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$13.21
RFQ
2,526
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
299-87-626-10-002101
Per Unit
$5.68
RFQ
2,544
Ships today + free overnight shipping
Preci-Dip CONN IC DIP SOCKET 26POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 26 (2 x 13) Beryllium Copper - Brass
Default Photo
Per Unit
$11.37
RFQ
1,760
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$11.79
RFQ
2,451
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (2 x 13) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$2.63
RFQ
1,634
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.43
RFQ
3,194
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.40
RFQ
2,715
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.49
RFQ
786
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 26 (2 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$8.90
RFQ
2,371
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.90
RFQ
2,225
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.90
RFQ
2,202
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.90
RFQ
2,013
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.90
RFQ
1,329
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 26POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (2 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
Page 1 / 2