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10 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
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2,669
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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3,927
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | ||
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1,682
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FP | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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2,609
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | ||
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3,926
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|
Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||
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3,087
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | |||
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2,130
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | |||
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3,263
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Microchip Technology | IC EEPROM 1MBIT 150NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | EEPROM | 10ms | Parallel | |||
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2,933
Ships today + free overnight shipping
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Microchip Technology | IC EEPROM 1MBIT 250NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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3,612
Ships today + free overnight shipping
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Microchip Technology | IC EEPROM 1MBIT 200NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 200ns | EEPROM | 10ms | Parallel |
