- Series :
- Part Status :
- Operating Temperature :
- Core Processor :
- EEPROM Size :
- Data Converters :
- Oscillator Type :
76 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,488
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NXP USA Inc. | 16-BIT MCU S12X CORE 256KB FLA | HCS12X | Active | Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 91 | 16K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 256KB (256K x 8) | Flash | 4K x 8 | A/D 16x12b | External | |||
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908
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE POWER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,457
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NXP USA Inc. | 2MB NVM 2 X E200Z4 CORES 150MH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,956
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,848
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,210
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,975
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NXP USA Inc. | 16-BIT MCU S12X CORE 256KB FLA | HCS12X | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 119 | 16K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 256KB (256K x 8) | Flash | 4K x 8 | A/D 24x12b | External | |||
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2,053
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NXP USA Inc. | 16-BIT MCU S12X CORE 256KB FLA | HCS12X | Active | Tray | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 91 | 16K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 256KB (256K x 8) | Flash | 4K x 8 | A/D 16x12b | External | |||
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2,303
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NXP USA Inc. | IC MCU 32BIT 2.5MB FLASH 144LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | 79 | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,910
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NXP USA Inc. | 32 BIT,2M FLASH,120MHZ | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,755
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,811
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NXP USA Inc. | SINGLE CORE, 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,364
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,898
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NXP USA Inc. | FREESCALE 32-BIT MCU DUAL CORE | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,267
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,778
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NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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793
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NXP USA Inc. | 1MB NVM 2 X E200Z4 CORES 180MH | MPC57xx | Active | Tray | -40°C ~ 135°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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623
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,215
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,427
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NXP USA Inc. | 32 BIT,2M FLASH,256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,657
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NXP USA Inc. | 1MB, 128K RAM, 144PIN | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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849
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,950
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,408
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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1,582
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,620
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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916
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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1,206
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NXP USA Inc. | DUAL CORE 2M FLASH 256 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,894
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NXP USA Inc. | 912XDT512J1 GENERAL | HCS12X | Active | Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 59 | 20K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 512KB (512K x 8) | Flash | 4K x 8 | A/D 8x12b | External | |||
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961
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 2MB (2M x 8) | Flash | - | A/D 24x12b | Internal |
