- Part Status :
- Packaging :
- Voltage - Supply (Vcc/Vdd) :
- Connectivity :
-
- CAN, CSIO, I²C, LIN, UART/USART (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB (2)
- CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, UART/USART (3)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (8)
- CAN, EBI/EMI, LIN, SCI, SPI, UART/USART (1)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (15)
- EEPROM Size :
- Oscillator Type :
31 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
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2,701
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Texas Instruments | IC MCU 32BIT 4MB FLASH 337NFBGA | RM | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (13x13) | DMA, POR, PWM, WDT | ARM® Cortex®-R5F | 330MHz | 1.14 V ~ 3.6 V | 145 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, UART/USART | 4MB (4M x 8) | Flash | 128K x 8 | A/D 57x10/12b | External | |||
|
1,276
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
3,866
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
1,043
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
621
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
3,359
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
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798
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 416BGA | PX | Obsolete | Tray | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z7 | 264MHz | 3 V ~ 5.5 V | 198 | 256K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI, UART/USART | 4MB (4M x 8) | Flash | - | A/D 64x12b | Internal | |||
|
2,098
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|
NXP USA Inc. | 32 BITDUAL CORE4M FLAS | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
3,148
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
815
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
1,753
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
2,880
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
3,925
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
1,084
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
1,052
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
940
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|
NXP USA Inc. | 32 BITDUAL CORE4M FLAS | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
2,476
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
3,808
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516MAPBGA | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
678
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|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
2,283
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
3,439
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
3,427
Ships today + free overnight shipping
|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
1,054
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|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
603
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 208LQFP | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
3,185
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|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,757
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|
Texas Instruments | IC MCU 32BIT 4MB FLASH 337NFBGA | RM | Active | Bulk | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R5F | 330MHz | 1.14 V ~ 3.6 V | 145 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, UART/USART | 4MB (4M x 8) | Flash | 128K x 8 | A/D 57x10/12b | External | ||||
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2,354
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|
Cypress Semiconductor Corp | IC MCU 32BIT 4MB FLASH 176LQFP | Traveo S6J3110 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (26x26) | DMA, LVD, POR, PWM, WDT | ARM® Cortex®-R5F | 144MHz | 3.5 V ~ 5.25 V | 150 | 384K x 8 | 32-Bit | CAN, CSIO, I²C, LIN, UART/USART | 4MB (4M x 8) | Flash | - | A/D 64x12b | Internal | ||||
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1,451
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|
Cypress Semiconductor Corp | IC MCU 32BIT 4MB FLASH 176LQFP | Traveo S6J3110 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (26x26) | DMA, LVD, POR, PWM, WDT | ARM® Cortex®-R5F | 144MHz | 3.5 V ~ 5.25 V | 150 | 384K x 8 | 32-Bit | CAN, CSIO, I²C, LIN, UART/USART | 4MB (4M x 8) | Flash | - | A/D 64x12b | Internal | ||||
|
1,908
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|
Texas Instruments | IC MCU 32BIT 4MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R5 | Active | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA | DMA, POR, PWM, WDT | ARM® Cortex®-R5F | 330MHz | 1.14 V ~ 3.6 V | 145 | 512K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, UART/USART | 4MB (4M x 8) | Flash | 128K x 8 | A/D 57x10/12b | External | ||||
|
3,960
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|
Renesas Electronics America | IC MCU 32BIT 4MB FLASH 176LFQFP | Renesas Synergy™ S7 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LFQFP (24x24) | DMA, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 240MHz | 2.7 V ~ 3.6 V | 126 | 640K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB | 4MB (4M x 8) | Flash | 64K x 8 | A/D 21x12b, D/A 2x12b | Internal |