- Part Status :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (10)
- DIP, 0.3" (7.62mm) Row Spacing (18)
- DIP, 0.6" (15.24mm) Row Spacing (104)
- DIP, 0.9" (22.86mm) Row Spacing (9)
- DIP, ZIF (ZIP) (5)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (28)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (33)
- DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing (1)
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (117)
- Polybutylene Terephthalate (PBT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (6)
- Polyester, Glass Filled (4)
- Polyether Imide (PEI), Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (68)
- Polysulfone (PSU), Glass Filled (3)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
209 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
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2,161
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|
3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 40 (2 x 20) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
|
GET PRICE |
3,434
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
3,259
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
3,354
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
2,831
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
3,847
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
2,874
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
1,057
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|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
GET PRICE |
1,816
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
GET PRICE |
2,933
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|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
1,612
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
|
GET PRICE |
2,994
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
1,109
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
1,509
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 40 (2 x 20) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | ||||
|
1,357
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,973
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,040
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
2,135
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
3,842
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
812
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
3,755
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
3,394
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
|
3,342
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
|
3,905
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
|
1,662
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
|
2,948
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
|
1,876
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
|
2,115
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
|
1,282
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
2,566
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass |