6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,973
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 12 (1 x 12) Beryllium Copper - Brass
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2,002
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Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,163
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Amphenol FCI CONN SOCKET SIP 12POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,156
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Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
979
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Amphenol FCI CONN SOCKET SIP 12POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,381
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) - - 12 (1 x 12) Beryllium Copper - Beryllium Copper
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