Contact Finish - Mating :
Contact Material - Post :
224 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$31.21
RFQ
1,918
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Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
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Per Unit
$31.21
RFQ
937
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$31.21
RFQ
713
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$31.21
RFQ
1,286
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$31.21
RFQ
901
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$31.21
RFQ
2,996
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$63.12
RFQ
2,381
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$63.12
RFQ
1,898
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$63.12
RFQ
1,246
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$63.12
RFQ
1,442
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$63.12
RFQ
2,683
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
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GET PRICE
RFQ
2,183
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (2 x 16) Beryllium Copper Flash Brass
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RFQ
3,440
Ships today + free overnight shipping
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (2 x 16) Beryllium Copper Flash Brass
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Per Unit
$57.32
RFQ
3,707
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$26.62
RFQ
3,991
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$26.37
RFQ
2,504
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$26.24
RFQ
1,788
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$37.26
RFQ
1,359
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Brass 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$31.66
RFQ
2,422
Ships today + free overnight shipping
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$31.66
RFQ
1,947
Ships today + free overnight shipping
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$16.29
RFQ
3,977
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$16.29
RFQ
1,128
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$16.29
RFQ
3,529
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$16.29
RFQ
3,565
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$16.14
RFQ
1,527
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 32 (2 x 16) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
Per Unit
$16.14
RFQ
3,771
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$16.14
RFQ
1,789
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$16.14
RFQ
1,474
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$16.14
RFQ
3,665
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$27.63
RFQ
2,946
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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