Contact Finish - Mating :
Contact Finish Thickness - Mating :
Number of Positions or Pins (Grid) :
1628 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$24.66
RFQ
3,252
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
GET PRICE
RFQ
2,886
Ships today + free overnight shipping
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
GET PRICE
RFQ
3,837
Ships today + free overnight shipping
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
28-516-10
GET PRICE
RFQ
2,644
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
GET PRICE
RFQ
1,927
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
GET PRICE
RFQ
3,434
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$160.04
RFQ
2,467
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$147.27
RFQ
3,345
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$141.38
RFQ
2,836
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$140.84
RFQ
1,541
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$137.45
RFQ
1,295
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$136.51
RFQ
1,927
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$135.42
RFQ
2,073
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$130.01
RFQ
2,486
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$129.46
RFQ
1,232
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$123.50
RFQ
2,079
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$118.93
RFQ
633
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$118.93
RFQ
1,416
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$117.00
RFQ
1,231
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 432 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$116.30
RFQ
1,125
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$113.75
RFQ
3,763
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 420 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$108.34
RFQ
1,371
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 400 (20 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$107.03
RFQ
1,242
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$105.09
RFQ
849
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 388 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$102.75
RFQ
1,343
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$99.89
RFQ
975
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$48.52
RFQ
1,172
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 272 (20 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$45.66
RFQ
3,682
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 256 (16 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$45.66
RFQ
1,409
Ships today + free overnight shipping
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 256 (20 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$35.75
RFQ
1,057
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Page 1 / 55