12 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
110-13-304-41-001000
Per Unit
$5.82
RFQ
2,955
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$1.45
RFQ
3,929
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Aries Electronics CONN IC DIP SOCKET 4POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
Default Photo
Per Unit
$6.45
RFQ
2,596
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$6.38
RFQ
3,954
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$0.52
RFQ
1,881
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
Default Photo
Per Unit
$6.92
RFQ
3,319
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$6.67
RFQ
1,511
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$2.71
RFQ
3,268
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
Default Photo
Per Unit
$2.71
RFQ
3,922
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
Default Photo
Per Unit
$0.87
RFQ
3,778
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
Default Photo
Per Unit
$7.10
RFQ
762
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper Brass Alloy
Default Photo
Per Unit
$2.26
RFQ
2,906
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper Brass
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