10 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
3,837
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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RFQ
3,605
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Phosphor Bronze
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Per Unit
$5.64
RFQ
3,912
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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Per Unit
$5.64
RFQ
3,215
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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Per Unit
$8.95
RFQ
2,037
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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Per Unit
$8.95
RFQ
1,773
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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Per Unit
$8.72
RFQ
2,940
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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Per Unit
$8.72
RFQ
2,349
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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Per Unit
$5.22
RFQ
3,920
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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Per Unit
$5.22
RFQ
876
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 16POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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