- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
95 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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1,953
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Copper | |||
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1,656
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | |||
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3,259
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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3,354
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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3,848
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | |||
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1,919
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | |||
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937
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | |||
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713
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | |||
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1,612
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | |||
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1,637
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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3,707
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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1,788
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | |||
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3,863
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | |||
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1,509
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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1,214
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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2,395
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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2,882
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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2,278
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Copper | |||
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1,630
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Copper | |||
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1,748
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 44 (2 x 22) | Beryllium Copper | |||
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656
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 44 (2 x 22) | Beryllium Copper | |||
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3,945
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 44 (2 x 22) | Beryllium Copper | |||
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3,179
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 44 (2 x 22) | Beryllium Copper | |||
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3,013
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | |||
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1,016
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | |||
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2,158
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | |||
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3,955
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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1,308
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 36 (2 x 18) | Beryllium Copper | |||
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1,195
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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2,536
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Copper |