- Mounting Type :
- Features :
- Contact Finish Thickness - Mating :
6 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
1,541
Ships today + free overnight shipping
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Beryllium Copper | Brass | |||
|
|
|
1,680
Ships today + free overnight shipping
|
Preci-Dip | CONN SOCKET PGA 520POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 520 (31 x 31) | Beryllium Copper | Brass | |||
|
|
|
3,755
Ships today + free overnight shipping
|
Preci-Dip | CONN SOCKET PGA 520POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 520 (31 x 31) | Beryllium Copper | Brass | |||
|
|
|
2,266
Ships today + free overnight shipping
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Brass | Brass | |||
|
|
|
3,322
Ships today + free overnight shipping
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Brass | Brass | |||
|
|
|
683
Ships today + free overnight shipping
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Beryllium Copper | Brass |
