- Part Status :
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- Features :
- Housing Material :
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- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (17)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
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28 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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3,241
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Amphenol FCI | CONN SOCKET SIP 26POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
GET PRICE |
3,507
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Amphenol FCI | CONN SOCKET SIP 26POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,043
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,742
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
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2,284
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
2,931
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
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1,080
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
2,766
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|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | ||||
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3,785
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
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1,628
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,380
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
|
2,939
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
1,249
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|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (1 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | ||||
|
2,573
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Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
3,979
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|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
3,325
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|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,731
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|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,784
Ships today + free overnight shipping
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
3,699
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|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
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2,713
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
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3,385
Ships today + free overnight shipping
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
|
1,515
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
2,395
Ships today + free overnight shipping
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
2,558
Ships today + free overnight shipping
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,816
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|
Harwin Inc. | CONN SOCKET SIP 26POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 26 (1 x 26) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
|
3,192
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
2,873
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 26POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
3,619
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|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass |