Series :
Contact Finish Thickness - Mating :
8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
Default Photo
Per Unit
$18.15
RFQ
3,597
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$18.15
RFQ
1,254
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$18.15
RFQ
2,683
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$18.15
RFQ
1,460
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$15.17
RFQ
2,376
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$15.17
RFQ
3,434
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$13.65
RFQ
3,043
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
Per Unit
$13.65
RFQ
3,007
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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