4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$14.21
RFQ
1,370
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$14.21
RFQ
1,233
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.21
RFQ
1,398
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.21
RFQ
1,720
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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