4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$4.11
RFQ
2,401
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.11
RFQ
1,675
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$7.23
RFQ
3,245
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.23
RFQ
3,995
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 12POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (2 x 6) Beryllium Copper 10.0µin (0.25µm) Brass
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