- Manufacture :
- Series :
- Operating Temperature :
- Mounting Type :
- Features :
- Housing Material :
- Pitch - Mating :
4 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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2,248
Ships today + free overnight shipping
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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2,766
Ships today + free overnight shipping
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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2,420
Ships today + free overnight shipping
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3M | CONN IC DIP SOCKET ZIF 64POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,797
Ships today + free overnight shipping
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3M | CONN IC DIP SOCKET ZIF 64POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper |
