8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$13.54
RFQ
3,921
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.06
RFQ
2,794
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
64-9518-10
Per Unit
$5.99
RFQ
2,817
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.74
RFQ
3,121
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$11.28
RFQ
3,189
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$10.81
RFQ
1,949
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$13.47
RFQ
2,660
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$8.58
RFQ
3,772
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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