8 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$2.71
RFQ
658
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.06
RFQ
1,657
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.70
RFQ
3,148
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.64
RFQ
2,973
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.99
RFQ
3,331
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.97
RFQ
2,189
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.90
RFQ
2,946
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.08
RFQ
3,406
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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