- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Plastic (1)
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (88)
- Polybutylene Terephthalate (PBT) (4)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (72)
- Polyester, Glass Filled (3)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic, Polyester (1)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Finish Thickness - Post :
185 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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728
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|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||
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2,860
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|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||
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2,772
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|
Amphenol FCI | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
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2,853
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|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||
|
|
|
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2,178
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||
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|
|
GET PRICE |
1,656
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 18 (2 x 9) | Beryllium Copper | 29.5µin (0.75µm) | Brass | ||
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|
|
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3,702
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||
|
|
|
GET PRICE |
2,652
Ships today + free overnight shipping
|
3M | CONN IC DIP SOCKET 18POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 18 (2 x 9) | Beryllium Copper | Flash | Brass | ||
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|
|
3,046
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|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
2,846
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|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
2,142
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
2,154
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
1,556
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
865
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
3,191
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
1,149
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
1,616
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
3,430
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
1,801
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
924
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,799
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
3,136
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
1,318
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
3,889
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,763
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,757
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
859
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
|
2,731
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
|
1,443
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
1,331
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass |
