- Part Status :
- Operating Temperature :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
6 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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3,477
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
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3,272
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 16 (2 x 8) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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2,788
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,017
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 16 (2 x 8) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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3,101
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
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2,644
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | - | Brass, Copper |