12 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,890
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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2,187
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,077
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Amphenol FCI CONN IC DIP SOCKET 14POS TINLEAD DPF3 Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,417
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Amphenol FCI CONN IC DIP SOCKET 14POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,387
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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3,743
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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RFQ
986
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,643
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - 14 (2 x 7) Beryllium Copper - Brass
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RFQ
3,541
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Brass
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RFQ
2,605
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) 14 (2 x 7) Beryllium Copper 5.00µin (0.127µm) Brass
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2,146
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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RFQ
1,197
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3M CONN IC DIP SOCKET 14POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 14 (2 x 7) Beryllium Copper Flash Brass
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