Contact Finish - Post :
Contact Material - Post :
207 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
2-641599-4
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RFQ
1,184
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 14 (2 x 7) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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RFQ
1,890
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,187
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,641
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, C93 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9114-00
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RFQ
1,946
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
2-1437531-2
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RFQ
2,587
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 14 (2 x 7) Copper Alloy - Copper Alloy
1-1825094-3
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RFQ
2,544
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
1825093-3
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RFQ
782
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 14 (2 x 7) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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Per Unit
$51.95
RFQ
2,031
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper - Copper
1825094-3
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RFQ
3,915
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 14 (2 x 7) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
1-1437531-8
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RFQ
778
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 14 (2 x 7) Copper Alloy - Copper Alloy
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RFQ
3,530
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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RFQ
2,605
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Gold 14 (2 x 7) Beryllium Copper 5.00µin (0.127µm) Brass
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Per Unit
$15.29
RFQ
1,558
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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Per Unit
$15.28
RFQ
3,324
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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Per Unit
$12.93
RFQ
2,215
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$12.35
RFQ
1,113
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$12.31
RFQ
1,470
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$11.96
RFQ
2,877
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-13-314-41-001000
Per Unit
$11.94
RFQ
1,814
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$11.92
RFQ
2,444
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$13.27
RFQ
1,806
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$12.04
RFQ
767
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$12.63
RFQ
3,803
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$5.68
RFQ
3,116
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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Per Unit
$5.68
RFQ
820
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$11.75
RFQ
938
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.75
RFQ
3,959
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.75
RFQ
1,203
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$12.11
RFQ
2,618
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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