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IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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Per Unit
$1.13
RFQ
3,856
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper Brass
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