- Operating Temperature :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Material - Post :
11 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
1,567
Ships today + free overnight shipping
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
3,499
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (2 x 13) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
2,544
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 26 (2 x 13) | Beryllium Copper | - | Brass | |||
|
|
|
1,760
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
|
2,451
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (2 x 13) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
2,013
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
1,329
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
2,350
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
1,551
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 26 (2 x 13) | Beryllium Copper | - | Brass | |||
|
|
|
3,392
Ships today + free overnight shipping
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
3,991
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
