- Operating Temperature :
63 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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1,798
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,132
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,692
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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3,964
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,464
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,400
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,249
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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1,735
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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2,958
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,293
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,052
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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894
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,064
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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1,337
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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1,626
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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1,472
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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3,940
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,710
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Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 12 (2 x 6) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,845
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,707
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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3,912
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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3,215
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
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3,825
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,037
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Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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3,732
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Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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626
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Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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2,037
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,773
Ships today + free overnight shipping
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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1,290
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | ||||
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713
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze |