7 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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RFQ
3,746
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS 500 Obsolete - - Through Hole - Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) - - - 22 (2 x 11) - -
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RFQ
1,441
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 22 (2 x 11) Beryllium Copper Brass
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Per Unit
$4.23
RFQ
737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper Nickel
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Per Unit
$3.99
RFQ
1,451
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper Beryllium Copper
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Per Unit
$9.93
RFQ
2,669
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS 500 Active - - Through Hole - Closed Frame DIP, 0.4" (10.16mm) Row Spacing - 0.100" (2.54mm) - - - 22 (2 x 11) - -
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Per Unit
$7.02
RFQ
3,422
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper Beryllium Copper
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Per Unit
$6.94
RFQ
1,623
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 22 (2 x 11) Beryllium Copper Brass, Copper
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