4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
802
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
3,394
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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Per Unit
$3.00
RFQ
849
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 8 (2 x 4) Beryllium Copper 47.2µin (1.20µm) Copper Alloy
808-AG11D-ES-LF
Per Unit
$1.23
RFQ
2,772
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Copper
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