5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$10.77
RFQ
2,920
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-320-01-670800
Per Unit
$1.83
RFQ
3,340
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-99-320-01-670800
Per Unit
$1.76
RFQ
2,084
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-44-320-41-001000
Per Unit
$0.96
RFQ
1,385
Ships today + free overnight shipping
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS TIN 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
DILB20P-223TLF
Per Unit
$0.33
RFQ
2,062
Ships today + free overnight shipping
Amphenol FCI CONN IC DIP SOCKET 20POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 20 (2 x 10) Copper Alloy 100.0µin (2.54µm) Copper Alloy
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