5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
Default Photo
Per Unit
$2.71
RFQ
2,695
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 24 (2 x 12) Beryllium Copper Brass
Default Photo
Per Unit
$3.24
RFQ
2,717
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 28 (2 x 14) Beryllium Copper Brass, Copper
Default Photo
Per Unit
$1.90
RFQ
3,297
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 16 (2 x 8) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$2.34
RFQ
1,075
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Gold 32 (2 x 16) Copper Alloy Copper Alloy
508-AG10D-ESL
Per Unit
$1.11
RFQ
2,219
Ships today + free overnight shipping
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 5.00µin (0.127µm) Gold 8 (2 x 4) Beryllium Copper Brass
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