Contact Finish Thickness - Post :
Contact Material - Post :
780 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$24.66
RFQ
2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
645
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Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
54020-84030LF
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RFQ
1,886
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Amphenol FCI CONN SOCKET PLCC 84POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 84 (4 x 21) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
54020-52030LF
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RFQ
3,221
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Amphenol FCI CONN SOCKET PLCC 52POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 52 (4 x 13) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
54020-68030LF
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RFQ
1,455
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Amphenol FCI CONN SOCKET PLCC 68POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 68 (4 x 17) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
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RFQ
3,410
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Amphenol FCI CONN SOCKET PLCC 52POS TIN - Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 150.0µin (3.81µm) 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) 150.0µin (3.81µm) Phosphor Bronze
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RFQ
3,928
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Preci-Dip CONN SOCKET PLCC 84POS TIN 540 Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin - 84 (4 x 21) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
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RFQ
3,280
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CNC Tech CONN SOCKET PLCC 84POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 84 (4 x 21) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
2,423
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CNC Tech CONN SOCKET PLCC 68POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 68 (4 x 17) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
3,862
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CNC Tech CONN SOCKET PLCC 52POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
3,083
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CNC Tech CONN SOCKET PLCC 44POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 44 (4 x 11) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
894
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CNC Tech CONN SOCKET PLCC 32POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 32 (4 x 8) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
1,759
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CNC Tech CONN SOCKET PLCC 28POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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RFQ
2,980
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CNC Tech CONN SOCKET PLCC 20POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 20 (4 x 5) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
10-18-2031
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RFQ
3,670
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Molex, LLC CONN SOCKET TRANSIST TO-220 3POS 4038 Obsolete - - Through Hole Solder Closed Frame Transistor, TO-220 Polyester, Glass Filled 0.100" (2.54mm) Tin - 3 (Rectangular) Brass 0.100" (2.54mm) 100.0µin (2.54µm) Brass
0009483031
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RFQ
2,439
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Molex, LLC CONN SOCKET TRANSIST TO-220 3POS - Obsolete Bulk -40°C ~ 80°C Through Hole Solder Closed Frame Transistor, TO-220 Polyamide (PA66), Nylon 6/6 - Tin 100.0µin (2.54µm) 3 (Rectangular) Brass - 100.0µin (2.54µm) Brass
28-516-10
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RFQ
2,644
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
24-516-10
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RFQ
1,927
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
40-516-10
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RFQ
3,434
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$118.93
RFQ
3,784
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$118.93
RFQ
3,639
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$108.11
RFQ
1,002
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$108.11
RFQ
2,595
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$108.11
RFQ
2,010
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$108.11
RFQ
1,398
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$103.32
RFQ
3,180
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$103.32
RFQ
2,355
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$103.32
RFQ
1,594
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$103.32
RFQ
2,608
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,661
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Amphenol FCI CONN SOCKET SIP 31POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 31 (1 x 31) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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