6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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Per Unit
$48.52
RFQ
1,172
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Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 272 (20 x 20) Beryllium Copper
Default Photo
Per Unit
$80.01
RFQ
1,160
Ships today + free overnight shipping
Preci-Dip CONN SOCKET PGA 272POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash 272 (20 x 20) Beryllium Copper
Default Photo
Per Unit
$78.55
RFQ
739
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Preci-Dip CONN SOCKET PGA 272POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash 272 (20 x 20) Beryllium Copper
Default Photo
Per Unit
$78.23
RFQ
3,082
Ships today + free overnight shipping
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 272 (20 x 20) Brass
Default Photo
Per Unit
$73.67
RFQ
1,288
Ships today + free overnight shipping
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 272 (20 x 20) Beryllium Copper
Default Photo
Per Unit
$69.64
RFQ
2,860
Ships today + free overnight shipping
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) 272 (20 x 20) Brass
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