4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
3,705
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
814
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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RFQ
2,265
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
2-1571995-0
Per Unit
$2.46
RFQ
1,604
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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