Contact Finish - Mating :
Contact Finish Thickness - Post :
1150 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
2-382719-1
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3,215
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 30 (2 x 15) Beryllium Copper - Beryllium Copper
2-382714-1
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RFQ
2,279
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-382712-1
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RFQ
3,477
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
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RFQ
3,835
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,452
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Beryllium Copper 200.0µin (5.08µm) Brass
268-5401-52-1102JH
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RFQ
3,406
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-50-1102JH
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RFQ
2,908
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-11-1102JH
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RFQ
1,245
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3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
2,161
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3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 40 (2 x 20) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
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RFQ
806
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3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) 20 (2 x 10) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
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Per Unit
$48.58
RFQ
3,874
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) - Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$47.71
RFQ
1,478
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Aries Electronics CONN SOCKET PGA GOLD PG Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,814
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 11 (1 x 11) Beryllium Copper - Beryllium Copper
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RFQ
1,816
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 40 (2 x 20) Beryllium Copper - Brass
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RFQ
3,830
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TE Connectivity AMP Connectors CONN SOCKET SIP 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 18 (1 x 18) Beryllium Copper - Beryllium Copper
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RFQ
2,226
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TE Connectivity AMP Connectors CONN SOCKET SIP 8POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 8 (1 x 8) Beryllium Copper - Beryllium Copper
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RFQ
2,812
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Brass
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RFQ
726
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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Per Unit
$57.26
RFQ
1,192
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) - Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
986
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
643662-1
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RFQ
1,378
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TE Connectivity AMP Connectors CONN SOCKET SIP 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 30 (1 x 30) Beryllium Copper - Beryllium Copper
643648-1
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RFQ
1,283
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (1 x 16) Beryllium Copper - Beryllium Copper
643644-1
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RFQ
2,129
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 12 (1 x 12) Beryllium Copper - Beryllium Copper
2-641599-2
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RFQ
2,835
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641268-1
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RFQ
1,821
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper - Beryllium Copper
2-641612-1
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RFQ
2,582
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-641609-1
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RFQ
835
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Beryllium Copper
2-641615-1
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RFQ
863
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
2-641267-1
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RFQ
1,056
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
2-641262-1
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RFQ
3,755
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
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