- Part Status :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Material - Post :
35 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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2,250
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
GET PRICE |
1,364
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|
Assmann WSW Components | CONN IC DIP SOCKET 22POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 22 (2 x 11) | - | - | - | |||
|
GET PRICE |
1,116
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 22 (2 x 11) | Beryllium Copper | 25.0µin (0.63µm) | Copper | |||
|
GET PRICE |
2,466
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 22 (2 x 11) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
|
1,027
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|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,626
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|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,472
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,451
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Beryllium Copper | - | Beryllium Copper | ||||
|
2,105
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|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
762
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 22 (2 x 11) | Beryllium Copper | Flash | Copper | ||||
|
3,960
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | - | 22 (2 x 11) | Copper Alloy | - | - | ||||
|
1,542
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|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
3,457
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|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,899
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,839
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
3,344
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,616
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
1,667
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
1,683
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|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
2,571
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
1,269
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
1,352
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
2,344
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
3,855
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
2,934
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
|
2,040
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 22 (2 x 11) | Copper Alloy | - | - | ||||
|
2,020
Ships today + free overnight shipping
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Phosphor Bronze | - | Phosphor Bronze | ||||
|
1,434
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
3,160
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
912
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze |