28 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
3,707
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,991
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
1,128
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,529
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,813
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,770
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,516
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,544
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
848
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,609
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
965
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
1,607
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
668
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,034
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,226
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,266
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,087
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
1,318
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,738
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
3,356
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
3,227
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
2,166
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
813
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,766
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
1,373
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
1,631
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
2,117
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
1,654
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper |
