28 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,802
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper - Brass
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RFQ
2,149
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (1 x 20) Beryllium Copper - Brass
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RFQ
1,231
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Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (1 x 18) Beryllium Copper - Brass
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RFQ
3,042
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Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (1 x 16) Beryllium Copper - Brass
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RFQ
1,236
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Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (1 x 14) Beryllium Copper - Brass
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RFQ
3,973
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (1 x 12) Beryllium Copper - Brass
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RFQ
3,521
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Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (1 x 10) Beryllium Copper - Brass
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RFQ
1,362
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 9 (1 x 9) Beryllium Copper - Brass
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RFQ
3,194
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Harwin Inc. CONN SOCKET SIP 8POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (1 x 8) Beryllium Copper - Brass
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RFQ
1,684
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Harwin Inc. CONN SOCKET SIP 7POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 7 (1 x 7) Beryllium Copper - Brass
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RFQ
2,955
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Harwin Inc. CONN SOCKET SIP 6POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (1 x 6) Beryllium Copper - Brass
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RFQ
2,665
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Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 5 (1 x 5) Beryllium Copper - Brass
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RFQ
1,164
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Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 4 (1 x 4) Beryllium Copper - Brass
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Per Unit
$1.37
RFQ
3,025
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.28
RFQ
2,302
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.50
RFQ
829
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$4.63
RFQ
2,930
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Harwin Inc. CONN IC DIP SOCKET 42POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$4.37
RFQ
616
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Harwin Inc. CONN IC DIP SOCKET 48POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 48 (2 x 24) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$2.97
RFQ
2,251
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Harwin Inc. CONN IC DIP SOCKET 32POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.69
RFQ
2,398
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.67
RFQ
1,905
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
D95028-42
Per Unit
$3.24
RFQ
1,809
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Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.60
RFQ
967
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.98
RFQ
3,716
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.91
RFQ
651
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.89
RFQ
1,286
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$0.98
RFQ
2,933
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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Per Unit
$1.14
RFQ
1,761
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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