- Series :
- Part Status :
- Mounting Type :
- Features :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
18 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GET PRICE |
2,864
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 40 (2 x 20) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | ||
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GET PRICE |
839
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 24 (2 x 12) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | ||
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3,885
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,264
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,920
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On Shore Technology Inc. | CONN IC DIP SOCKET 28POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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925
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On Shore Technology Inc. | CONN IC DIP SOCKET 48POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 48 (2 x 24) | Beryllium Copper | Flash | Brass | |||
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1,221
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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2,824
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,863
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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1,247
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN IC DIP SOCKET 40POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
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3,819
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,468
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN IC DIP SOCKET 24POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
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677
Ships today + free overnight shipping
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On Shore Technology Inc. | CONN IC DIP SOCKET 64POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 64 (2 x 32) | Beryllium Copper | Flash | Brass | |||
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1,932
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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3,716
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,690
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 32 (2 x 16) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
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2,301
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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2,186
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |
