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6 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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2,184
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Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 16 (2 x 8) | - | - | - | ||
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2,188
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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3,942
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 16 (2 x 8) | Beryllium Copper | Flash | Beryllium Copper | |||
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3,338
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On Shore Technology Inc. | CONN IC DIP SOCKET 16POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 16 (2 x 8) | Beryllium Copper | Flash | Brass | |||
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2,846
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Omron Electronics Inc-EMC Div | CONN ZIG-ZAG 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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2,402
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |
