- Part Status :
5 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GET PRICE |
2,459
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Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
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1,471
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,026
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,483
Ships today + free overnight shipping
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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3,850
Ships today + free overnight shipping
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |
