- Manufacture :
- Part Status :
- Operating Temperature :
- Termination :
- Contact Finish - Post :
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16 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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668
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | ||||
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2,805
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
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3,212
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 12POS GOLD | - | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Press-Fit | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | ||||
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3,659
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 20.0µin (0.51µm) | Tin-Lead | 3 (Round) | Beryllium Copper | - | 20.0µin (0.51µm) | Beryllium Copper | ||||
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3,204
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | ||||
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2,008
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | 510 | Active | Tube | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin-Lead | 10 (1 x 10) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | ||||
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1,957
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 10 (1 x 10) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | ||||
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849
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | 47.2µin (1.20µm) | Copper Alloy | ||||
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1,886
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TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 12 (1 x 12) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | ||||
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3,127
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TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 16 (1 x 16) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | ||||
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2,674
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Aries Electronics | CONN SOCKET SOIC ZIF 44POS GOLD | 547 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SOIC, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 20.0µin (0.51µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.050" (1.27mm) | 20.0µin (0.51µm) | Beryllium Copper | ||||
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3,410
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Aries Electronics | CONN SOCKET SOIC ZIF 44POS GOLD | 547 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SOIC, ZIF (ZIP) | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 20.0µin (0.51µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.050" (1.27mm) | 20.0µin (0.51µm) | Beryllium Copper | ||||
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3,988
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 20 (1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper | ||||
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856
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | ||||
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1,577
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | 47.2µin (1.20µm) | Copper Alloy | ||||
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1,583
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TE Connectivity AMP Connectors | CONN SOCKET SIP 2POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 2 (1 x 2) | Beryllium Copper | 0.100" (2.54mm) | 20.0µin (0.51µm) | Copper |