3 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$3.21
RFQ
676
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.21
RFQ
2,364
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.21
RFQ
3,368
Ships today + free overnight shipping
Aries Electronics CONN IC DIP SOCKET 4POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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